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Dr. Henning Braunisch - FEMA
(Fellow of The Electromagnetics Academy)
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Position: |
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Process Technology Development Engineer,Components Research |
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Laboratory: |
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Department: |
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Components Research |
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University/Institute: |
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Intel Corporation |
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Country/Area: |
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USA |
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Webpage URL: |
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Professional Interests: |
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Microelectronic packaging, applied electromagnetics, and related areas including signal processing and applied mathematics. Simulation of physical and technological systems. Forward and inverse modeling and development of algorithms. Prototyping of proof-of-concept test vehicles. Microwave metrology. |
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Most Important Publication: |
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H. Braunisch, J.E. Jaussi, J.A. Mix, M.B. Trobough, B.D. Horine, V. Prokofiev, D. Lu, R. Baskaran, P.C. H. Meier, D.-H. Han, K.E. Mallory, and M.W. Leddige, "High-speed flex-circuit chip-to-chip interconnects," IEEE Trans. Adv. Packag., vol. 31, no. 1, pp. 82-90, Feb. 2008. |
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![[EM Wave]](wave.gif)
