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Most Important Publication: |
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[1] "Domain Decomposition Methods for Electromagnetic Field Boundary Value Problems" Wei Hong et al, Science Press (in Chinese), Beijing, 2005.
[2] "Development of Millimeter-Wave Planar Diplexers Based on Complementary Characters of Dual-Mode Substrate Integrated Waveguide Filters With Circular and Elliptic Cavities," Hong Jun Tang, Wei Hong, Ji-Xin Chen, Guo Qing Luo, and Ke Wu, IEEE Trans. on MTT, vol. 55, No. 4, pp. 776 -782, 2007.
[3] "Half Mode Substrate Integrated Waveguide: A New Guided Wave Structure for Microwave and Millimeter Wave Application," Hong, Wei et al (Keynote Talk). Joint 31st Int. Conf. on Infrared and Millimeter Waves and 14th Int. Conf. on Terahertz Electronics, Shanghai, Sept. 18-22, 2006
[4] "Theory and Experiment of Novel Frequency Selective Surface Based on Substrate Integrated Waveguide Technology," G. Q. Luo, Wei Hong et al, IEEE Trans. on AP, vol. 53, No. 12, pp. 4035-4043, Dec. 2005.
[5] "Development of Microwave Antennas, Components and Subsystems Based on SIW Technology," Wei Hong (Plenary Speech), IEEE Int. Conf. on Mirowave, Antenna, Propagation and EMC (MAPE), Beijing, Aug. 8-12, 2005.
[6] "Domain decomposition FDTD algorithm for the analysis of a new type of E-Plane sectorial horn with aperture field distribution optimization," Feng Xu, Wei Hong, IEEE Trans. on Antennas and Propagation, Vol.52, no.2, 2004, pp.426-434.
[7] "Generalized Z-domain absorbing boundary conditions for the analysis of electromagnetic problems with finite-difference time-domain method," Z. H. Shao, W. Hong, and J. Y. Zhou, IEEE Trans. Microwave Theory and Techniques, vol. 51, no.1, pp. 82-90, 2003.
[8] "A Z-Transform Based Absorbing Boundary Conditions for 3-D TLM-SCN Method," Zhenhai Shao, Wei Hong, IEEE Trans. on MTT, Vol. 50, No.1, pp.222-225, 2002.
[9]"A generalized algorithm for the capacitance extraction of 3D VLSI interconnects," Z.H. Zhu, and Wei Hong, IEEE Trans. on MTT, Vol.47, No.10, pp.2027-2030, 1999
[10] "Dimension Reduction Technique for Parameter Extraction of 3D VLSI Interconnects," Wei Hong, W. K. Sun, Z. H. Zhu, Hao Ji, B. Song, and W. W. M. Dai, IEEE Trans. on MTT, Vol. 46, No. 8, pp. 1037-1044, 1998 |
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